Starting date : Avr. 2017 > Avr. 2020Lifetime: 36 months
Program in support : ECSEL
Status project : complete
CEA-Leti's contact :
Gabriel Parel
Project Coordinator: Amkor formerly Nanium S.A. (PO)
Partners: - BESI AT, (AT)
- EVG, (AT)
- AMIC, (DE)
- Elmos, (DE)
- FhG, (DE)
- KETEK, (DE)
- InnoSenT, (DE)
- NANOTEST, (DE)
- PacTech, (DE)
- RoodMicrotec, (DE)
- Silicon Radar, (DE)
- TexEDA, (DE)
- Afore, (FI)
- NT, (FI)
- MAS, (FI)
- Murata, (FI)
- SPV, (FI)
- VTT, (FI)
- CEA-Leti, (FR)
- NXP FR, (FR)
- P-SIP, (FR)
- Valeo, (FR)
- 3Dis, (FR)
- SEMILAB, (FR)
- BESI NL, (NL)
- Sencio, (NL)
- NANIUM, (PT)
- Advanced Vacuum, (SE)
Target market: n/a
Investment: € 29 m.
EC Contribution: € 7.2 m.
| Stakes
Main CEA-Leti outcomes, through its active participation in a major European consortium of the most prominent companies in the field, include development of advanced packaging technologies such as fan-out wafer level packaging. CEA-Leti is contributing its expertise in designing and assembling the highly reliable Systems in Package (SiP) modules required for automotive applications. Working closely with industrial end-users and packaging house partners in building an operational SiP camera module, the ambition is to raise technological readiness for transfer to industry (TRL 4).
The EuroPAT-MASIP project reinforces Europe’s semiconductor manufacturing position by focusing on the semiconductor and MEMS packaging ecosystem. Semiconductor packaging, assembly and testing involve most of the semiconductor value chain, ranging from material suppliers through software design and packaging foundries to test houses. Euro-PAT-MASIP consolidates and extends the continent’s leadership in semiconductor processing know-how by developing and fostering packaging-related technological and manufacturing building blocks for different (emerging) industrial sectors through:
- Modelling, design and simulation of key packaging-related features and challenges
- Developing key packaging technologies, equipment and materials
- Heterogeneous (3D) integration of smart system building blocks (More-than-Moore, MtM) and System in Package (SIP)
- Establishing testing strategy including metrology, methods and equipment, reliability and failure analysis.
The project is accelerating manufacturing uptake of new technologies and is curtailing time to market by demonstrating industrial need-based application pilots with new capabilities. The automotive application pilots embody manufacturing science, are based on the industrial partner’s needs and capabilities, and are therefore industry compatible.
EuroPAT-MASIP is striving to increase the competitiveness and the global market share of the European semiconductor industry by fostering the competence and capabilities of semiconductor packaging. Actions are being implemented to facilitate cooperation of European semiconductor and MEMS packaging ecosystems to ensure joint network creation on completion of the project. The EuroPAT-MASIP consortium actively promotes capabilities and related ecosystems to attract talent and tackle academic issues. The project outcomes will ultimately enhance the technological attractiveness for private investment and talent by developing and promoting the key capabilities to match the future needs of European industries and emerging technology stakeholders.
|
|